FM - International Conference
Novel Non-volatile Inorganic Memory Devices: materials, concepts and applications
Co-Chairs:
Hideo OHNO, Tohoku University, Japan
Rainer WASER, Forschungszentrum Juelich, Germany
H.-S. Philip WONG, Stanford University, USA
Programme Chair:
Sabina SPIGA, CNR-IMM, Agrate Brianza, Italy
Members:
Ritesh AGARWAL, University of Pennsylvania, USA
Marin ALEXE, Max Planck Inst.of Microstructure Physics, Germany
Marco BERNASCONI, Università di Milano-Bicocca, Italy
Gennadi BERSUKER, Sematech, USA
Roberto BEZ, Micron, Italy
Caroline BONAFOS, CEMES/CNRS, France
I-Wei CHEN, University of Pennsylvania, USA
Albert CHIN, National Chiao Tung University, Taiwan
Daping CHU, University of Cambridge, UK
Sorin CRISTOLOVEANU, IMEP-INP Grenoble MINATEC, France
Panagiotis DIMITRAKIS, NCSR "Demokritos", Greece
Yoshihisa FUJISAKI, Hitachi Ltd., Japan
Tsuyoshi HASEGAWA, NIMS, Japan
Bryan D. HUEY, University of Connecticut, USA
Cheol Seong HWANG, Seoul National University, Korea
Hyunsang HWANG, POSTECH, Korea
Daniele IELMINI, Politecnico di Milano, Italy
Anquan JIANG, Fudan University, China
Alexander V. KOLOBOV, AIST, Japan
Bart J. KOOI, University of Groningen, Netherlands
Ming LIU, Institute of Microelectronics, CAS, China
Janice H. NICKEL, Hewlett-Packard Labs, USA
Stuart S.P. PARKIN, IBM, USA
Shashi PAUL, De Montfort University, UK
Luca PERNIOLA, CEA-LETI, France
Santiago SERRANO-GUISAN, International Iberian Nanotechnology Lab. (INL), Portugal
Luping SHI, Tsinghua University, China
Dmitri STRUKOV, University of California, Santa Barbara, USA
Eisuke TOKUMITSU, JAIST, Japan
Dirk WOUTERS, IMEC, Belgium
Matthias WUTTIG, RWTH Aachen, Germany
Hideo OHNO, Tohoku University, Japan
Rainer WASER, Forschungszentrum Juelich, Germany
H.-S. Philip WONG, Stanford University, USA
Programme Chair:
Sabina SPIGA, CNR-IMM, Agrate Brianza, Italy
Members:
Ritesh AGARWAL, University of Pennsylvania, USA
Marin ALEXE, Max Planck Inst.of Microstructure Physics, Germany
Marco BERNASCONI, Università di Milano-Bicocca, Italy
Gennadi BERSUKER, Sematech, USA
Roberto BEZ, Micron, Italy
Caroline BONAFOS, CEMES/CNRS, France
I-Wei CHEN, University of Pennsylvania, USA
Albert CHIN, National Chiao Tung University, Taiwan
Daping CHU, University of Cambridge, UK
Sorin CRISTOLOVEANU, IMEP-INP Grenoble MINATEC, France
Panagiotis DIMITRAKIS, NCSR "Demokritos", Greece
Yoshihisa FUJISAKI, Hitachi Ltd., Japan
Tsuyoshi HASEGAWA, NIMS, Japan
Bryan D. HUEY, University of Connecticut, USA
Cheol Seong HWANG, Seoul National University, Korea
Hyunsang HWANG, POSTECH, Korea
Daniele IELMINI, Politecnico di Milano, Italy
Anquan JIANG, Fudan University, China
Alexander V. KOLOBOV, AIST, Japan
Bart J. KOOI, University of Groningen, Netherlands
Ming LIU, Institute of Microelectronics, CAS, China
Janice H. NICKEL, Hewlett-Packard Labs, USA
Stuart S.P. PARKIN, IBM, USA
Shashi PAUL, De Montfort University, UK
Luca PERNIOLA, CEA-LETI, France
Santiago SERRANO-GUISAN, International Iberian Nanotechnology Lab. (INL), Portugal
Luping SHI, Tsinghua University, China
Dmitri STRUKOV, University of California, Santa Barbara, USA
Eisuke TOKUMITSU, JAIST, Japan
Dirk WOUTERS, IMEC, Belgium
Matthias WUTTIG, RWTH Aachen, Germany
Marco BERNASCONI, Università di Milano-Bicocca, Italy
Roberto BEZ, Micron Semiconductor Itali, Italy
Julie GROLLIER, CNRS/Thales, France
Alexei GRUVERMAN, University of Nebraska-Lincoln, USA
Tsuyoshi HASEGAWA, NIMS - MANA, Japan
Cheol Seong HWANG, Seoul National University, Korea
Daniele IELMINI, Politecnico di Milano, Italy
Etienne JANOD, Universitè de Nantes, France
Jinfeng KANG, Peking University, China
Ming LIU, Institute of Microelectronics, CAS, China
Massimo LONGO, CNR-IMM, Italy
Thomas MIKOLAJICK, Nam-Lab, Germany
Beatriz NOHEDA, University of Groningen, Netherlands
Hideo OHNO, Tohoku University, Japan
Lucian PREJBEANU, INAC/CEA Grenoble, France
Dafinè RAVELOSONA, Université Paris Sud, France
Ilan RIESS, Technion - Israel Institute of Technology, Israel
Dmitri STRUKOV, University of California, Santa Barbara, USA
Andy THOMAS, Bielefeld University, Germany
Junji TOMINAGA, AIST, Japan
Elisa VIANELLO, IMM-CNR, Italy
Rainer WASER, Forschungszentrum Juelich, Germany
R. Stanley WILLIAMS / Janice H. NICKEL, Hewlett-Packard Labs, USA
C.David WRIGHT, University of Exeter, UK
Matthias WUTTIG, RWTH, Aachen, Germany
Roberto BEZ, Micron Semiconductor Itali, Italy
Julie GROLLIER, CNRS/Thales, France
Alexei GRUVERMAN, University of Nebraska-Lincoln, USA
Tsuyoshi HASEGAWA, NIMS - MANA, Japan
Cheol Seong HWANG, Seoul National University, Korea
Daniele IELMINI, Politecnico di Milano, Italy
Etienne JANOD, Universitè de Nantes, France
Jinfeng KANG, Peking University, China
Ming LIU, Institute of Microelectronics, CAS, China
Massimo LONGO, CNR-IMM, Italy
Thomas MIKOLAJICK, Nam-Lab, Germany
Beatriz NOHEDA, University of Groningen, Netherlands
Hideo OHNO, Tohoku University, Japan
Lucian PREJBEANU, INAC/CEA Grenoble, France
Dafinè RAVELOSONA, Université Paris Sud, France
Ilan RIESS, Technion - Israel Institute of Technology, Israel
Dmitri STRUKOV, University of California, Santa Barbara, USA
Andy THOMAS, Bielefeld University, Germany
Junji TOMINAGA, AIST, Japan
Elisa VIANELLO, IMM-CNR, Italy
Rainer WASER, Forschungszentrum Juelich, Germany
R. Stanley WILLIAMS / Janice H. NICKEL, Hewlett-Packard Labs, USA
C.David WRIGHT, University of Exeter, UK
Matthias WUTTIG, RWTH, Aachen, Germany
Non-volatile memory devices are currently key elements of several electronics and portable systems (digital camera, solid state disks, smartphones, computers, e-books, tablets,..) and their market has been increasing exponentially in the last decade. Even though the Flash memory represents today the leading technology, to allow its scalability down to the 16 nm technology node and beyond, increased costs and new architectures are necessary. Therefore, several emerging non-volatile memory concepts, also exploiting new storage mechanisms, are under investigation to achieve better performance, higher scalability, density and speed than Flash, as well as to address low power consumption, 3D/cross bar architecture, low thermal budget, and compatibility with flexible substrates and embedded systems. For the high-density non-volatile memories toward a 3D cross-point architecture it is also necessary to develop an appropriate two-terminal selector device, such as mixed ionic electronic conductor, oxide-based and polysilicon diodes or threshold switch. Finally, the new paradigm is not only to pursue the standard downscaling of non-volatile memories in terms of minimum size and integration density, which is approaching physical limits, but also to address new strategies towards functional diversification of electronics devices. One important aspect will be to develop memory storage concepts that can integrate multiple functionalities provided by novel materials, and to fabricate devices that in addition to non-volatile storage are able, for instance, to perform reconfigurable operations and emulating brain functions.
This conference, that follows and enlarges the sessions held on the subject in the frames of previous CIMTEC Conferences, will address recent advances on inorganic non-volatile memory devices with focus on innovative storage concepts beyond Flash and charge based memories, new materials and devices, integration schemes and selectors for the storage elements, understanding and modelling of new physical mechanisms for data storage, down to the nanoscale.
This conference, that follows and enlarges the sessions held on the subject in the frames of previous CIMTEC Conferences, will address recent advances on inorganic non-volatile memory devices with focus on innovative storage concepts beyond Flash and charge based memories, new materials and devices, integration schemes and selectors for the storage elements, understanding and modelling of new physical mechanisms for data storage, down to the nanoscale.
Session Topics
FM-1 Resistance switching memories (ReRAM)
- Electrochemical metallization (EMC) and valence change (VCM) memories
- Atom switch
- Mott transition
- Interface Schottky switching
- Nanowire-based ReRAM
- Nanometallic ReRAM
- Correlated electron memory
- Mechanisms and modelling
FM-2 Phase change memories (PCM)
- New materials for PCM
- Theory and modelling
- Low power devices
- Nanostructure-based PCM
- Interfacial phase change memories
- Integration schemes
FM-3 Magnetic, ferroelectric and multiferroic materials for memory devices
- MRAM
- Spin transfer torque (STT)-MRAM
- Magnetic nanostructures
- Racetrack concept
- FeRAM
- Ferroelectric FET
- Novel materials for FeRAM
FM-4 Memristive materials, devices and emerging applications
- Storage class memories
- Neuromorphic circuits
- Reconfigurable electronics and cognitive applications
