Symposium CD
Joining Inorganic Materials at Different Length Scales

Programme Chair:
Jolanta JANCZAK, EMPA, Switzerland

Members:
Viola L. ACOFF, University of Alabama, USA
Florian BANHART, Universitè de Strasbourg, France
Mathieu BROCHU, McGill University, Canada
John A. FERNIE, AWE, UK
Natalya FROUMIN, Ben-Gurion University of the Negev, Israel
Masahiro FUKUMOTO ,Toyohashi University of Technology, Japan
Andreas GLAESER, University of California, Berkeley, USA
Dmitry G. GROMOV, Moscow Institute of Electronic Technology, Russia
Michael C. HALBIG, NASA Glenn Research Center, USA
Akio HIROSE, Osaka University, Japan
Fiqiri HODAJ, Grenoble Institute of Technology, France
Yu-Dong HUANG, Harbin Institute of Technology, China
Wayne KAPLAN, Technion - Israel Institute of Technology, Israel
Kevin M. KNOWLES, University of Cambridge, UK
Katsuyoshi KONDOH, Osaka University, Japan
Charles LEWINSOHN, Ceramatec Inc., USA
Leijun LI, Utah State University, USA
Yongfeng LU, University of Nebraska-Lincoln, USA
Alberto PASSERONE, IENI-CNR, Italy
Ivar E. REIMANIS, Colorado School of Mines, USA
Eduardo SAIZ GUTIERREZ, Imperial College, UK
Julius C. SCHUSTER, University of Vienna, Austria
Natalia SOBCZAK, Foundry Research Institute, Poland
Ravi Kant SONI, Indian Institute of Technology Delhi, India
Tadatomo SUGA, University of Tokyo, Japan
Shun-ichiro TANAKA, Tohoku University, Japan
Mauricio TERRONES, Pennsylvania State University, USA
Jun WEI, Singapore Institute of Manufacturing Technology, Singapore
Michael AIZENSHTEIN, Ben-Gurion University of the Negev, Israel
Cristina ARTINI, IENI-CNR, Italy
Mathieu BROCHU, McGill University, Canada
Dominique CHATAIN, CINaM-CNRS, France
John A. FERNIE, AWE, UK
Akio HIROSE, Osaka University, Japan
Jolanta JANCZAK-RUSCH, EMPA, Switzerland
Vikram JAYARAM, Indian Institute of Science, India
Wayne KAPLAN, Technion - Israel Institute of Technology, Israel
Georges KAPTAY, University of Miskolc, Hungary
Charles LEWINSOHN, Ceramatec Inc., USA
Yoshiaki MORISADA, Osaka University, Japan
Alberto PASSERONE, IENI-CNR, Italy
Katarzyna PIETRZAK, Institute of Electronic Materials Technology, Poland
Noritaka SAITO, Kyushu University, Japan
Hisashi SERIZAWA, Osaka University, Japan
Federico SMEACETTO, Politecnico di Torino, Italy
Shun-ichiro TANAKA, IMRAM, Tohoku University, Japan
Hiroshi TSUDA, Osaka Prefecture University, Japan
Masahiro TSUKAMOTO, Osaka University, Japan
Klaus VAN BENTHEM, University of California, Davis, USA
Rachel ZUCKER, MIT, USA
Advances in methods for joining materials at macro-, micro- or nano-scale, to provide adequate mechanical coupling, environmental protection or electrical connections to devices and engineering systems are unavoidable needs for a myriad of applications especially those that have to withstand extreme stresses, temperature and chemical environments or to fulfil the needs of the continuing trends to miniaturisation. In order to develop integration methods for emerging materials into advanced components and produce long-term reliable devices, the behavior of material surfaces and interfaces needs to be well understood as their properties ultimately control the reliability of material joints and systems. This symposium, which follows the ones held on similar subjects at previous CIMTEC Conferences, will discuss fundamental and practical issues of inorganic materials joining, across length scales and from both the experimental and theoretical viewpoints concerning: physical-chemistry of surfaces and interfaces; wetting and interfacial reactions; diffusion and compound formation; adhesion; joining techniques of soldering, brazing, solid state and transient liquid phase diffusion bonding and microwave/laser/electron beam welding; joint characterisation and testing; lifetime and reliability predictions of joints, and their in-service performance. Developing techniques of nano-joining processes (such as solid-state nano-bonding, femtosecond laser irradiation joining, in-situ or focused e-beam processing, ultrasonic nano-welding …), their understanding across research disciplines and length scales are challenging steps for faster, more reliable and cheaper routes for nanomaterials integration in micro- and macro-scale devices and systems. Contributions on every aspect of materials joining, from theory of interfaces to practical issues of joining techniques are welcome. Specific matter on which the Authors are encouraged to concentrate include: i-Modelling of materials joints and processes at different length scales (from atomic scale modelling of interfaces to engineering scale simulations); ii-Experimental and theoretical studies on thermodynamics, diffusion kinetics, wetting and adhesion; iii-Joining of metals, ceramics, glasses, composites to each other or to dissimilar materials; iv-Use of nanoeffects in joining methods and the development of nanostructured joining materials; v-Mechanisms and materials science of nano-joining; vi-Joining of nanostructures such as carbon nanotubes and graphene and their integration into micro- and macro-scale devices and systems vii-Application engineering from micro- to macro-scale.
Session Topics

CD-1 Basic issues

  • Thermodynamics and kinetics of interface formation
  • Mechanisms of wetting and adhesion
  • Theory, modelling and simulation of interfaces

CD-2 Macro-joining

  • Advances in joining methods and materials
  • Thermal and chemical stability of joints
  • Strength, fracture and reliability of joints
  • Prediction, modification and measurements of residual stresses
  • Joint modelling, design, characterisation and analysis
  • New testing methods and NDT of joints

CD-3 Micro-/nano-joining

  • Mechanisms and materials science of micro-/nano-joining
  • Nanoscale effects
  • Micro-/nano-joining techniques
  • Joint design and analysis
  • Joining for integration in micro- and macro-scale devices and systems
  • Energy, functional, biomedical and other ongoing or forecast applications

CD-4 Application engineering

  • Joining and integration issues at the macro-, micro- and nanoscales in diverse areas
  • Joining techniques for microelectromechanic systems and microelectronic packaging
  • Joints for energy applications (nuclear and thermoelectric power, solid oxide fuel cells, ..)
  • Joining for structural applications (aerospace, automotive industry)
  • Biomedical joints

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Cimtec 2014

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